Since its spin-off in September 2025 AUMOVIO continues the business of the former Continental group sector Automotive as an independent company. The technology and electronics company offers a wide-ranging portfolio that makes mobility safe, exciting, connected, and autonomous. This includes sensor solutions, displays, braking and comfort systems as well as comprehensive expertise in software, architecture platforms, and assistance systems for software-defined vehicles. In the fiscal year 2024 the business areas, which now belong to AUMOVIO, generated sales of 19.6 billion Euro. The company is headquartered in Frankfurt, Germany and has about 87.000 employees in more than 100 locations worldwide.
*Job Description**
The SiP System and Design Architect (m/f/d) is responsible for following tasks:
Translating product and use-case requirements into executable SiP functional architectures, chip or chiplet partitions and package-level design concepts
SiP floorplanning, die-to-die communication concepts, substrate electrical architecture and package-board interfaces
System-level concepts covering performance, dataflow, timing, boot, power management, functional safety, cybersecurity interfaces, testability, redundancy and repair
Setting up virtual architecture models that enable early performance assessment and design-space exploration before physical implementation
Maintaining architecture specifications, interface definitions, design constraints and cross-domain alignment between system, silicon, software, package, test and manufacturing stakeholders
Representing AUMOVIO in relevant external industry associations, consortia and collaborative research programs and for transferring applicable results, requirements and ecosystem developments into internal SiP architecture activities
Capturing and analyzing product requirements, workloads, interfaces, safety goals, timing constraints, power targets, package limitations, and cost assumptions
Developing alternative chip and chiplet partitioning concepts and evaluate functional allocation, dataflow, latency, bandwidth, power, reuse, supply risk and scalability
Creating SystemC and Transaction-Level Modeling based executable models for architecture exploration, performance assessment and interface evaluation
Defining die-to-die interface requirements and protocol concepts, including bandwidth, latency, coherency, link initialization, monitoring, error handling and interoperability constraints
Developing preliminary SiP floorplans covering die placement, interface proximity, routing resources, power distribution, thermal constraints, keep-out regions and test access
Defining the package electrical architecture, including substrate stack-up requirements, high-speed routing constraints, power-delivery concepts, grounding and decoupling strategy
Developing architecture concepts for boot, power sequencing, clocking, reset, diagnostics, functional safety, cybersecurity interfaces, redundancy and repair
Defining design for test, design for manufacturability, design for reliability and system-level test requirements together with the respective experts and external partners
Coordinating architecture trade-offs and design reviews with product, integrated-circuit, software, package, simulation, test, safety, security and supplier stakeholders
Academic degree in Electrical Engineering, Microelectronics or comparable qualification
In-depth experience in semiconductor technology
Long-term experience in IC design methodology and EDA tools
Several years of experience in System-on-Chip, multi-die, System-in-Package or complex embedded-system architecture
In-depth experience in system architecture, chip partitioning, performance modeling, interface definition and hardware/software co-design
Profound Experience with SystemC, Transaction-Level Modeling or comparable virtual prototyping and architecture exploration methods
Deep Knowledge of high-speed die-to-die and package interfaces (like with Universal Chiplet Interconnect Express - UCIe), protocol concepts, signal and power integrity constraints and substrate design fundamentals
Knowledge of boot, clock, reset, power management, diagnostics, functional safety, cybersecurity interfaces, redundancy and repair concepts
Experience with package or substrate floorplanning, electrical package design, layout constraints and design-rule handover preferred
Experience in design for test, system-level test concepts and requirements engineering for automotive electronics preferred
Business fluent English language skilles (written and spoken), German language skills preferred
Initiative - self-confident, taking ownership and acting proactively
Ability to learn continuously by being open and flexible to new tasks/fields
Good Communication skills
Customer focus - anticipating and understanding the customers' needs
Motivation and Inspiration
Team player and contributes towards team goals
Applications from severely handicapped people are welcome.
*Additional Information**
Next to the interesting daily work the region around Regensburg is offering a high recreational value and quality of life.
Profit from extensive benefits at the location such as different canteens and cafeterias, a continuing education and training, health management, physiotherapy and much more.
We offer an attractive salary as well as the possibility of hybrid and cross-border mobile work.
For an improved work-life balance we support you with various initiatives for a better compatibility of family and career such as flexible work time model, part-time option, sabbatical, etc.
You can expect a highly motivated team as well as diverse topics and projects in the global environment of the automotive industry.
We are promoting lifelong Learning combined with personal and professional development.
You are looking for an individual working time model? We support part-time work.
You would like to learn more about our additional services? Click [here](https://www.aumovio.com/en/career/why-join-us.html).
Ready to take your career to the next level? The future of mobility isn’t just anyone’s job. Make it yours! **Join AUMOVIO. Own What’s Next.**
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