Senior Integrated Photonics Packaging Engineer (m/f/d)

micro-lens arrays).

• Cross-Functional Collaboration: Partner closely with PIC designers, systems engineers, and electronics teams to ensure packaging architectures are co-designed with device- and system-level constraints in mind.
• Build Institutional Knowledge: Document process recipes, assembly procedures, design rules, and tolerance budgets to enable manufacturability assessments, repeatability, and IP generation.
• Technical Supplier Alignment: Coordinate with external partners and suppliers for specialized materials or fabrication capabilities as the technical lead who specifies and validates rather than manages delivery.
• Mentorship & Leadership: Mentor junior engineers and contribute to shaping the team’s overall packaging R&D roadmap.

Your profile

• Education: Master’s or Ph.D. in Photonics, Optoelectronics, Electrical Engineering, Physics, or a related field (a Ph.D. with an experimental packaging or integration focus is strongly preferred).
• Hands-on Experience: 5+ years of hands-on R&D experience in photonic/optoelectronic packaging, hybrid integration, or high-density interconnect development within a research institution, deep-tech startup, or advanced R&D environment.
• Prototyping & Co-Integration Track Record: Proven experience conceiving, building, and characterizing novel packaging prototypes-specifically co-integrating PICs, laser sources/SOAs, photodetectors, and high-speed analog electronics.
• Technical Depth: Deep understanding of optical alignment/coupling methods, flip-chip/wire bonding, die attach, hermetic encapsulation, RF signal integrity, and thermal management.
• Lab & Tool Proficiency: Hands-on proficiency with optical characterization (insertion loss, far-field imaging, OLCR/OFDR, LIV testing) and electrical characterization tools (VNA, high-speed oscilloscopes). Familiarity with CAD layout tools and optical simulation software (e.g., Zemax , Lumerical ) is a plus.
• Mindset & Ownership: High degree of autonomy and creative problem-solving skills to navigate complex, competing constraints without off-the-shelf solutions. Strong self-leadership and collaboration skills.
• Languages: Fluent in English; knowledge of German or another European language is a plus.

Why us?

• Work on the leading edge: Photonic AI acceleration technologies that will define the next decade of computing - already validated in production HPC environments.
• Make impact at scale: Help solve one of computing's biggest

challenges -  making growing demand in compute and sustainability go hand in hand.

• Own your work from day one: Broad autonomy and decision authority with direct impact on product success, packaging baselines, and overall PIC module quality.
• Fast-track your growth: Work on challenges with few industry

precedents - every problem you solve becomes new institutional knowledge and potentially industry-defining IP.

• World-class team: Collaborate alongside a passionate, international, cross-functional team of experts in photonics, processor design, and AI systems.
• Direct access to leadership: Work closely with the company's leaders within a transparent and fast-moving structure.
• Collaborative culture: Innovative work environment that values technical excellence, open communication, and pragmatic problem-solving.
• Be part of history: Join at the inflection point where photonic computing transitions from research to mainstream—your contributions will shape this transformation.

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Quelle: Statistisches Bundesamt (Destatis), Tabelle; dl-de/by-2-0; eigene Berechnung